发明名称 PLASMA TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment device capable of controlling a self-bias potential of an electrode without using any high frequency power source which is expensive and occupies a space. SOLUTION: A cathode 3, an anode 4 and a ring electrode 5 are arranged in such a manner as to expose to the inside of a reactor chamber 2. In the state in which treatment gas is introduced into the reactor chamber 2, high frequency electric power is applied between the cathode 3 and the ring electrode 5, and the anode 4, thereby generating plasma inside the reactor chamber 2. A plasma CVD treatment device subjects the surface of a substrate W placed on the anode 4 to a predetermined process by using the resultant plasma. High frequency oscillators 21, 23 for applying high frequency electric power are connected to the cathode 3 and the ring electrode 5, respectively. Furthermore, a matching circuit 30 consisting of a coil and a capacitor for varying the impedance of the anode 4 to thus control a self-bias potential of the anode 4 is connected to the anode 4.
申请公布号 JP2000357600(A) 申请公布日期 2000.12.26
申请号 JP19990165937 申请日期 1999.06.11
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKEBAYASHI MOTONARI;RI UNRYU
分类号 H01L21/302;C23C16/505;C23F4/00;H01L21/205;H01L21/3065;H01L21/31;H05H1/46 主分类号 H01L21/302
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