发明名称 |
Wiring board, semiconductor device and production methods thereof |
摘要 |
<p>Wiring board having a wiring layer to which electronic components are electrically connected, in through-holes closed at one of the ends thereof by the wiring layer are formed at predetermined positions of the wiring board, and a low melting point metal for electrically connecting the wiring layer to the electronic components is filled into the through-holes, and a semiconductor device using the same. The production methods of the wiring board and the semiconductor device are also disclosed. <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE></p> |
申请公布号 |
EP1132962(A2) |
申请公布日期 |
2001.09.12 |
申请号 |
EP20010105301 |
申请日期 |
2001.03.06 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
HORIUCHI, MICHIO;KURIHARA, TAKASHI |
分类号 |
H05K1/14;H01L21/56;H01L21/60;H01L23/12;H01L23/498;H05K1/11;H05K3/34;(IPC1-7):H01L23/498;H01L23/538 |
主分类号 |
H05K1/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|