| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition showing no corrosiveness to metallic materials, good in workability without a solvent, and excellent in rapid curing, mechanical properties, adhesion, and chemical resistance, by curing a curable resin such as epoxy resin, etc., using a material which generates a base by light. SOLUTION: This composition comprises a compound of a specific structure containing a hetero ring, a compound containing at least two electrophilic groups which react with a thiol group or -S- group in a molecule, and a compound having a carbonyloxyimino group.
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