| 摘要 |
PROBLEM TO BE SOLVED: To provide a equipment for inspecting wire bond in which bonding state at a wire bonded part can be grasped accurately even when the bonding width is wide and the bonding strength is high between a power chip and a bonding wire. SOLUTION: In a wire bond tester T, a chip 3 bonded with a wire 2 undergoes shear test by means of a shear tester 1. The shear tester 1 detects shear strength every moment while shearing a wire bonded part 2a and delivers shear strength data to a data processing computer 4. The data processing computer 4 calculates an integrated value of shear strength based on the shear strength data and grasps bonding state at the wire bonded part 2a quantitatively and accurately based on the integrated value of shear strength. Furthermore, an image processing computer grasps the bonding state at the wire bonded part 2a quantitatively based on the image of a bonding flaw picked up by means of a camera. |
