SEMICONDUCTOR DEVICE

摘要

A memory device is disclosed. A semiconductor device comprises: a semiconductor substrate including a circuit region and a connection region arranged on one side of the circuit region; a logic structure including a logic circuit arranged in the circuit region, and a lower insulation film covering the logic circuit; a memory structure on the logic structure; and a stress reducing structure between the logic structure and the memory structure in the circuit region. Therefore, degradation of features of the logic structure can be reduced.