发明名称 BONDING METHOD FOR PIEZOELELCTRIC VIBRATOR
摘要 PURPOSE:To prevent short circuits caused by the overflow of an adhesive agent and to enable the manufacture of thin-plate piezoelectric vibrators having an excellent insulating property without taking special measures, in the case of bonding flexible printed boards for the thin-plate piezoelectric vibrators having protrusions partially on the surfaces to be bonded. CONSTITUTION:A bonding method for piezoelectric vibrators; a nonprinting pattern section 8 is provided at the corresponding parts to the protrusions of a printing pattern for printing an adhesive agent by a screen printing method, the nonprinting pattern such as circles, etc., in the section 8 has a pattern pitch 15 which corresponds to a proper quantity of the adhesive agent for a protrusion, and the adhesive agent is applied by the screen printing method using this pattern. When a flexible printed board for a thin-plate piezoelectric vibrator is bonded, short circuits do not occur by the overflow of the adhesive agent, and an insulating property is secured even in a high-temperature state. Accordingly, high-reliability piezoelectric vibrators can be obtained.
申请公布号 JPH04326579(A) 申请公布日期 1992.11.16
申请号 JP19910124867 申请日期 1991.04.25
申请人 TOKIN CORP 发明人 YUHARA KENSUKE
分类号 H01L41/08;H01L41/22 主分类号 H01L41/08
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