发明名称 Measurement of thermal conductivity of adhesive joint
摘要 An original method measures thermal conductivity of glued joints. The sample (10) comprises a central block (1) accepting and storing heat, with adhesive layers (4, 5) of known thickness on its two end faces. These layers are joined to a pair of outer sections (2, 3). All materials used in the sample, significantly, are those of the joint under study. The sample assembly has a pair of heaters (6) on the end faces. Heat losses to the surroundings are minimised. Heating is controlled to maintain a constant temperature gradient over time, from edges to the central plane of the sample. The temperature of the block (1) is measured continuously, or at regular intervals. From the rise in temperature, the temperature gradients, dimensions, mass and thermal capacity of the block, the thermal conductivity of the joint is calculated as a function or temperature. Also claimed is a detailed method of making the test sample for use as described, having essentially recesses for the adhesive, covered by end plates.
申请公布号 DE19629138(A1) 申请公布日期 1998.01.29
申请号 DE19961029138 申请日期 1996.07.19
申请人 HAHN, ORTWIN, PROF. DR.-ING., 33100 PADERBORN, DE 发明人 HAHN, ORTWIN, PROF. DR., 33100 PADERBORN, DE;MESCHUT, GERSON, 33689 BIELEFELD, DE;GORENFLO, DIETER, PROF. DR., 33014 BAD DRIBURG, DE;HUEBNER, PETER, 33100 PADERBORN, DE
分类号 G01N19/04;G01N25/18;G01N33/44;(IPC1-7):G01N25/20;C09J5/02;F17C3/08 主分类号 G01N19/04
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