| 摘要 |
PROBLEM TO BE SOLVED: To provide a module having an improved rigidity and dimension accuracy suitable for non-contact type IC card by mounting electronic components on an insulated plastic film having a circuit pattern on the internal base of a recessed body, filling the recessed part with curing resins, sealing and integrating the electronic components. SOLUTION: After electronic components composed of an IC chip are mounted on an insulated plastic film having a circuit pattern on the internal base of a recessed body, the recessed part is filled with curing resins, and the electronic components are sealed and integrated. Concerning such an IC module, the recessed body 20 is composed of laminated sheets 10, a side wall part 22 is provided continuously to an internal base part 21, and a connection terminal 23 with an antenna horizontally protruded from the upper end of that side wall is provided. This laminated sheet 10 has a structure provided with the insulated plastic film on a metal sheet while having the circuit pattern composed of a conductive thin film on its surface. |
