发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To achieve a high breakdown voltage compound semiconductor device which successfully inhibits both of current collapse and gate leakage current by a comparatively simple composition to achieve high reliability.SOLUTION: An AlGaN/GaN HEMT includes an electron transit layer 2b, an electron supply layer 2c formed on the electron transit layer 2b and a GaN cap layer 2d formed on the electron supply layer 2c. The electron supply layer 2c has a first layer which is an i-type AlGaN(0<x<1) and a second layer which is an i-type AlGaN(x<y≤1) formed on the first layer.SELECTED DRAWING: Figure 2
申请公布号 JP2016127110(A) 申请公布日期 2016.07.11
申请号 JP20140265977 申请日期 2014.12.26
申请人 FUJITSU LTD 发明人 YAMADA ATSUSHI;ISHIGURO TETSURO
分类号 H01L21/338;H01L21/336;H01L21/76;H01L29/778;H01L29/78;H01L29/786;H01L29/812 主分类号 H01L21/338
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