发明名称 |
COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To achieve a high breakdown voltage compound semiconductor device which successfully inhibits both of current collapse and gate leakage current by a comparatively simple composition to achieve high reliability.SOLUTION: An AlGaN/GaN HEMT includes an electron transit layer 2b, an electron supply layer 2c formed on the electron transit layer 2b and a GaN cap layer 2d formed on the electron supply layer 2c. The electron supply layer 2c has a first layer which is an i-type AlGaN(0<x<1) and a second layer which is an i-type AlGaN(x<y≤1) formed on the first layer.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016127110(A) |
申请公布日期 |
2016.07.11 |
申请号 |
JP20140265977 |
申请日期 |
2014.12.26 |
申请人 |
FUJITSU LTD |
发明人 |
YAMADA ATSUSHI;ISHIGURO TETSURO |
分类号 |
H01L21/338;H01L21/336;H01L21/76;H01L29/778;H01L29/78;H01L29/786;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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