Passively athermalized infrared imaging system and method of manufacturing same

摘要

In an embodiment, a method of aligning elements in a manufacturing process includes placing a middle element onto a base element, the base element forming first alignment features, the middle element forming apertures therethrough corresponding to the first alignment features. The method also includes placing second alignment features of an upper element onto the first alignment features such that the first and second alignment features cooperate, through the apertures, to align the upper element with the base element. An infrared lens assembly includes a lens formed of an infrared transmitting material that is disposed within a carrier of a base material, the lens being molded within the carrier with at least one feature that secures the lens to the carrier.

主权项

1. A method of aligning upper and lower wafers, the lower wafer having a plurality of first optical elements each respectively opposing one of a plurality of second optical elements of the upper wafer, and the lower wafer having a plurality of first alignment features each respectively opposing one of a plurality of second alignment features of the upper wafer, the method comprising: positioning a spacer wafer, the spacer wafer having a plurality of alignment apertures each respectively corresponding one of the plurality of first alignment features, on the lower wafer such that the plurality of alignment apertures align with the plurality of first alignment features; inserting, after the step of positioning, one of a plurality of alignment elements within the each of the alignment apertures; arranging the upper wafer on the spacer wafer such that the upper and lower wafers passively align via the plurality of alignment elements; wherein the first alignment features, and the respective first and second alignment features cooperate to passively align the upper wafer to the lower wafer in at least four degrees of freedom, the four degrees of freedom including: X- and Y-coordinates defining centering of each one of the plurality of first optical elements to a respective one of the plurality of second optical elements, a Z-coordinate defining spacing between the lower wafer and the upper wafer, and rotation of the lower wafer with respect to the upper wafer.