| 摘要 |
PURPOSE:To provide a method of laminating transcribed patterns on a film multilayer substrate, which enables a plurality of layers of patterns to be laminated on a board without causing molding inferiority or dislocation. CONSTITUTION:This is a method of laminating transcribed patterns on a film multilayer substrate, by which the patterns 3 and 4 being made on a base 1 and a carrier 2, respectively, are opposed to each other, and a prepreg 5 is put between both patterns 3 and 4, and the base 1 and the carrier 2 are heated while being pressed against each other, and after the curing of the prepreg 5, the carrier 2 is removed. This is so constituted that an adhesive 6 is injected between the base 1 and the carrier 2 after putting the prepreg 5 between both patterns 3 and 4, and that the curing of the prepreg 5 is performed after hardening the adhesive 6 in the condition that the base 1 and the carrier 2 are brought close to each other until the interval between these becomes the same as the thickness of the prepreg 5. |
