SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A semiconductor chip package is provided to prevent a void and a crack from being generated in a package body, by having an inclined sidewall of a receiving groove including a semiconductor chip and covered with a light transmitting glass cap. CONSTITUTION: A semiconductor chip package(100) includes a package body(110), a semiconductor chip(130), a plurality of leads(140) and a glass cap(150). The package body has a receiving groove(120) in a predetermined region of an upper surface. The semiconductor chip has bonding pads in a side, and the bonding pads are placed inside the receiving groove. The pluralities of leads are projected from the inside of the receiving groove to the outside of the package body, and are electrically connected to the bonding pads by a conductive wire. The glass cap is made of a light transmitting material so that a light receiving part can receive light, and covers an upper part of the receiving groove. A sidewall of the receiving groove is inclined by a predetermined slope, and a side of the glass cap contacting the sidewall of the receiving groove is inclined by a slope corresponding to the sidewall of the receiving groove.