首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SEMICONDUCTOR DIE BONDING APPARATUS
摘要
申请公布号
KR200183547(Y1)
申请公布日期
2000.06.01
申请号
KR19970040400U
申请日期
1997.12.24
申请人
HYUNDAI MICRO ELECTRONICS CO.,LTD.
发明人
LEE, JAE YONG
分类号
H01L21/52;(IPC1-7):H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
您可能感兴趣的专利
GAMMA RAYS EARTH AND SAND DETECTOR
AIR CURTAIN NOZZLE OF LASER SPEED METER
SURFACE INSPECTOR
TRANSISTOR LIMITER CIRCUIT
PREPARATION OF NOVEL RIBOSTAMYCIN
CULTIVATING OF EDIBLE MUSHROOM BY USING ARTIFICIAL CULTURE MEDIUM
ROTARY ENGINE
SOFT CAPSULE CONTAINING ACTIVE VITAMIN D3* AND ITS PREPARATION
BUFFER FOR ROLL SCREEN
ELECTRIC DEVICE MOUNTING APPARATUS
REDUCTION GEAR FOR BALL MILL
DETECTING METHOD OF CLEARANCE ON STATIC PRESSURE GUIDE FACE
ANTIIULCER MEDICAL COMPOSITION
GAS GENERATOR
PRODUCTION OF MOISTURE PEARMEABLE SYNTHETIC LEATHER
PREPAPATION OF SOLID RESOL RESIN
METHOD OF MAKING COIL PIPE
WATERPROOF LAMINATE
METHOD OF MAKING MOLD FOR PLASTICS
METHOD OF REDUCING HYDROGEN SULFIDE IN PRODUCTION OF WATER CRUSHED SLAG
