| 摘要 |
PURPOSE:To reduce input connection resistance in a COB method capable of performing high density packaging at least several ohms and suppressing the generation of a crosstalk phenomenon by connecting an input projected electrode of a semiconductor device to a metal wiring of a flexible printed board with a metal small-gauge wire. CONSTITUTION:There are provided a flexible printed board (FPC) and a semiconductor device 11 having an input projected electrode 3 and an output projected electrode 10 and a board 16 having an output connection electrode 7. There are further provided a conductive bonding agent 18 which connects the output projected electrode 10 to the output connection electrode 7 and a bonding agent 5 which fixes an FPC 1 with the semiconductor device 11 and a metal small- gauge wire 4 which connects the input projected electrode 3 to the metal wiring 2. More specifically, the semiconductor device 11 is fixed with the FPC 1 with an epoxy group bonding agent 5 while the metal small-gauge wire 4 is connected to an area between the input projected electrode 3 and the metal wiring 4 on the FPC 1 based on a wire bonding method. Then, the semiconductor device 11 is connected to the board 16. |
