| 发明名称 |
Making multilayer thin film component, assembles component units, each carrying component layers on supportive substrates |
| 摘要 |
Component units (2, 4) are made, each with a supportive substrate (17, 36) carrying a component layer (20, 40). The component units are combined, to produce the thin-layer component. An Independent claim is included for a corresponding component in which a light-emitting component layer is adhered to a photodetector layer. |
| 申请公布号 |
DE10047963(A1) |
申请公布日期 |
2001.03.29 |
| 申请号 |
DE2000147963 |
申请日期 |
2000.09.27 |
| 申请人 |
SONY CORP., TOKIO/TOKYO |
发明人 |
YAMAUCHI, KAZUSHI;MATSUSHITA, TAKESHI |
| 分类号 |
H01L21/02;H01L21/20;H01L21/77;H01L21/84;H01L21/98;H01L25/065;H01L27/00;H01L27/12;H01L31/02;H01L31/12;H01L31/173;H01L33/62 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
