| 摘要 |
<p>PURPOSE: To make it possible to manufacture a multilayered lead frame assembly for an integrated circuit die package, by a method wherein more than one insulating tape and a plane metal member are bonded together as the multilayered lead frame assembly. CONSTITUTION: B stage adhesion layers 20 and 40 are previously selected so that they are curable at different temperatures for enabling to bond separately a plane metal lead frame and a metal member operable as a ground plane and a heat sink to the opposed surfaces of an insulating tape 30. For example, it is possible that the layer 20 is curable at a temperature of 175 deg.C, but on the other hand, it is possible that the layer 40 is curable at a temperature of 275 deg.C. As the result, the B stage layers are used for bonding the lead frame to the tape 30 at a temperature which does not cure the layer 40, and subsequently to it, it is made possible that the metal member is separately bonded to the surface on one side of the opposed surfaces of the tape 30 afterwards.</p> |
