| 摘要 |
In a stage prior to insertion of the chip carrier element (2) in the recess (5) of the card body (1A) an additional gel type glue (7) is dispensed into the recess for connection of the resin housing (2B) with the card body. In conventional manner the chip carrier element (2) is pressed into the recess and fixed in place using heat and pressure. An Independent claim is made for a chip card comprised of two elements (2A,2B) and fixed with additional glue in the recess of the card body.
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