发明名称 CHIP PICKUP DEVICE AND CHIP PICKUP METHOD
摘要 PROBLEM TO BE SOLVED: To provide a chip pickup device which further easily exfoliates a chip and a collet while preventing the chip from being damaged.SOLUTION: The chip pickup device includes the collet. The collet comprises: a holder 2 having an opening that exposed an internally formed space; a curved surface 3b which is formed within the holder 2 at a side opposite to the opening 2a and protrudes in the space while being at least partially curved from one side to the other side; a first suction hole 3a that penetrates the curved surface 3b and is connected to pressure reduction control parts 6-8; an elastic adsorption plate 4 which is fitted into the opening 2a, includes a plurality of second suction holes 4a on a contact surface with a chip C on a tape 12 and is deformed in accordance with a pressure within a collet 2; and a suction groove 3c which is formed on at least one of mutually opposite surfaces of the adsorption plate 4 and the curved surface 3b and overlapped with at least a part of the first suction holes 3a and the second suction holes 4a.SELECTED DRAWING: Figure 4
申请公布号 JP2016152329(A) 申请公布日期 2016.08.22
申请号 JP20150029481 申请日期 2015.02.18
申请人 FUJITSU LTD 发明人 TADAKI SHINJI
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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