| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit structure excellent in heat dissipation.SOLUTION: In the circuit structure including a circuit board having an insulation plate provided with a first plate surface and a second plate surface and having a through hole penetrating from the first plate surface to the second plate surface, a metallic inlay component inserted into the through hole, an electronic component mounted on the first plate surface to be connected to the inlay component in a heat transmissible manner, and a heat dissipation member made of thermal conductive material and deployed at the second plate surface side through an insulation layer. The inlay component includes an insertion part that is inserted into the through hole, a projection part provided continuously to the insertion part to project toward the heat dissipation member from the second plate surface, and a recessed part with the projection part to be inserted thereinto at a position compatible with the projection part in the heat dissipation member.SELECTED DRAWING: Figure 8 |
