发明名称 METHOD OF PRODUCING FLAT MODULE
摘要 <p>A method and system to produce card modules by assembling and soldering components on a printed circuit board, characterized by retrieving specific printed circuit board-type from a printed circuit board storage having several types in response to a command signal, reading an identification code on the printed circuit board to obtain information concerning the board and then in response to this information, conveying the circuit board through selective processing stations for assembling components on the circuit board, through-stations for soldering the components on the circuit board to form an electronic card module and then through-stations for testing the card module in response to information obtained during reading. The testing station can also include one or more stations for performing the steps of fault-locating and for repairing located faults as necessary.</p>
申请公布号 JPS60260200(A) 申请公布日期 1985.12.23
申请号 JP19850103628 申请日期 1985.05.15
申请人 SIEMENS SCHUCKERTWERKE AG 发明人 EGON EDEINGAA;YOAHIMU KETSUTAA;DEIITOMAARU KURASUKE;KURAUSU KURUMURAI;IERUKU MAIZAA;URURITSUHI MIHIAERU
分类号 H05K13/02;G01R31/26;G01R31/28;G05B19/418;H05K13/04;H05K13/08 主分类号 H05K13/02
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