| 摘要 |
<p>Inert polymeric materials, for example polyamides, are bonded by applying to one or both surfaces a composition comprising a compound having a phenolic group and having substituents which reduce the toxicity of the compound, the composition being a solvent for the inert polymer, and mating the surfaces. Preferred compounds are carvacrol, and/or thymol. A eutectic mixture of carvacrol and thymol may be used to -20°C. Adhesives according to the invention have a polyamide dissolved in the composition.</p> |
