发明名称 |
High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip |
摘要 |
A hermetic semiconductor chip package includes a conductive foil bonded to a contact pad of the chip and connected to an external lead of the package through an aperture in the insulating material of the package lid. |
申请公布号 |
US5018002(A) |
申请公布日期 |
1991.05.21 |
申请号 |
US19890375641 |
申请日期 |
1989.07.03 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
NEUGEBAUER, CONSTANTINE A.;DAUM, WOLFGANG |
分类号 |
H01L23/049;H01L23/482;H01L23/485 |
主分类号 |
H01L23/049 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|