发明名称 ORGANIC COPPER COMPOUND, LIQUID MIXTURE CONTAINING THE COMPOUND, AND COPPER THIN-FILM PREPARED USING THE SOLUTION
摘要 <p>PURPOSE: Provided are organic copper compounds for making copper (Cu) thin-films used in wiring of semiconductor devices by a metal organic chemical vapor deposition (hereinafter referred to as MOCVD) process, liquid mixtures (solutions) containing the compounds, and copper thin-films prepared by the MOCVD process using the solutions. CONSTITUTION: The organic copper compound is represented by the following formula(1) in which monovalent copper is coordinated with a beta-diketone compound and an unsaturated hydrocarbon compound having a silyloxy group: wherein R Is an unsaturated hydrocarbon moiety, L is the beta-diketone compound, X1, X2, and X3 are each a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and X1, X2, and X3 may be the same or different from each other. The organic copper compound is barely decomposed in a stock solution before use, has a prolonged storage life, exhibits a high film deposition rate, can be effectively decomposed on a substrate, is highly volatile, and exhibits high adhesiveness to an underlayer.</p>
申请公布号 KR20010062431(A) 申请公布日期 2001.07.07
申请号 KR20000076502 申请日期 2000.12.14
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 ITSUKI ATSUSHI;OGI KATSUMI
分类号 C07F7/08;C07F7/18;C07F19/00;C23C16/18;H01L21/28;H01L21/285;(IPC1-7):C07F7/18 主分类号 C07F7/08
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