| 摘要 |
PROBLEM TO BE SOLVED: To improve flatness of a printed wiring board; improve mounting quality of a semiconductor element; prevent deterioration in electric function of a printed wiring board; and prevent the occurrence of failure such as a short circuit.SOLUTION: A printed wiring board with a bump comprises: a base insulation layer composed of an insulating material; a conductor layer which is formed on the base insulation layer and includes a conductor pad; a covering insulation layer which is formed on the base insulation layer and on the conductor layer and has an opening for exposing the conductor pad; and a bump formed on the exposed conductor pad, in which the bump has a plated metal post formed on the exposed conductor pad with a height equal to or lower than that of the covering insulation layer and a plated metal overlay layer which is formed on the plated metal post and composed of metal having a fusion temperature higher than that of solder.SELECTED DRAWING: Figure 1 |
