发明名称 GRANULATED POWDER, RESIN COMPOSITION FOR HEAT DISSIPATION, HEAT DISSIPATION SHEET, SEMICONDUCTOR DEVICE, AND HEAT DISSIPATION MEMBER
摘要 PROBLEM TO BE SOLVED: To provide granulated powder which enables the materialization of a heat dissipation sheet and a heat dissipation member, both superior in humidity resistance.SOLUTION: Granulated powder 10 comprises secondary cohering particles 30. The secondary cohering particles 30 are formed by the cohesion of primary particles 20. The primary particles 20 are ones of scale-like boron nitride. In a log differential pore volume distribution curve measured on granulated powder 10 according to a method of mercury penetration, at least one maximal value is located in a first range of 5.0 to less than 180 μm in pore size; no maximal value is present in a second range of 0.05 to less than 5.0 μm. In the log differential pore volume distribution curve measured on the granulated powder 10 according to the method of mercury penetration, the following condition is satisfied: I/Iis equal to or less than 0.05, where Irepresents the maximum of maximal values located in the first range, and Irepresents the maximum of maximum values located in the second range.SELECTED DRAWING: Figure 1
申请公布号 JP2016127046(A) 申请公布日期 2016.07.11
申请号 JP20140264277 申请日期 2014.12.26
申请人 SUMITOMO BAKELITE CO LTD 发明人 NAKANO SHOGO
分类号 H01L23/373;C01B21/064;H01L23/36;H05K7/20 主分类号 H01L23/373
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