| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method of a work devised so that upper and lower peripheral edge parts do not sag at the time of polishing the work on a polishing device. SOLUTION: Upper and lower peripheral edge parts of a work are polished roughly in the same thickness as a constant size carrier in a primary polishing process by using the constant size carrier as a carrier at the time of polishing on a polishing device of both surfaces. As a central part of the work is polished thinner than an outer peripheral edge part by this polishing, the outer peripheral edge part is made to match thickness of the central part by polishing it at the time of a secondary polishing process by the polishing device of the both surfaces or the one single surface. Additionally, the upper and lower peripheral edge parts of the work are polished in the primary polishing process without using the constant size carrier for the carrier at the time of polishing of the work on the polishing device of the both surfaces. As the outer peripheral edge part of the work is polished thinner than the central part by this polishing, the central part is polished to match the thickness of the outer peripheral edge part at the time of the secondary polishing process by the polishing device of the both surfaces or the one single surface. |
