Heat Dissipation in Hermetically-Sealed Packaged Devices

摘要

A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.

主权项

1. An apparatus comprising:
a hermetically sealed enclosure comprising a base portion and a lid; a plurality of heat generating elements supported by the base portion, the plurality of heat generating elements rising to a plurality of different heights from the base portion; and at least one resilient heat exchange component that extends from the lid of the hermetically sealed enclosure to the plurality of different heights and configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.