| 摘要 |
<p>PURPOSE:To improve a resin sealed type semiconductor integrated circuit device in coloring property and moisture resistance and make it colored and low in stress by a method wherein it is sealed up with a transfer resin sealing structure which is composed of two or more layers formed of, at least, two types of sealing resin. CONSTITUTION:A semiconductor chip 2 is mounted on the island of a lead frame 1, and the electrode terminal of the semiconductor chip 2 is connected to the lead of the lead frame 1 with a bonding wire 3. The lead frame 1, on which the semiconductor chip 2 is mounted, is covered with a highly adherent sealing resin 6, and then the adherent sealing resin 6 is covered with a low stress sealing resin 5. Furthermore, the low stress sealing resin 5 is covered with a laser marking coloring sealing resin 4, and then marking and the formation of leads are done through laser marking. As mentioned above, a sealing structure in which two or more layers are laminated is employed and sealing resins of different characteristics are used, whereby a resin sealed type semiconductor integrated circuit can be improved in coloring and moisture resistance and made colored and low in stress.</p> |
