| 摘要 |
PURPOSE:To obtain a low-profile semiconductor device easily by a method wherein a pre-heating unit in which a lead frame is pre-heated, a dipping bath and a fluid state unit in which powder resin is stored and a conveying unit are provided. CONSTITUTION:Semiconductor chips 19, islands 20 on which the semiconductor chips 19 are mounted, resin parts in which the semiconductor chips 19 are sealed and leads 21 connected to the semiconductor chips 19 are provided. In the manufacturing apparatus of semiconductor devices like these, a pre-heating unit 12 in which a lead frame 18 on which a plurality of sets of the parts corresponding to the islands 20 and the leads 21 are formed is pre-heated to a temperature not lower than the melting temperature of powder resin 33 of which the resin parts are to be made is provided. Further, a dipping bath 13 in which the powder resin 33 is stored and a fluid state unit in which the fluid powder resin is stored are provided. Moreover, a conveying unit 17 which transfers the pre- heated lead frame 18 into the dipping bath 13 to melt the powder resin 33 to form the resin parts and carries out the lead frame 18 on which the resin parts are formed from the dipping bath 13 is provided. |
