FLIP-CHIP SILICONE PRESSURE SENSITIVE CONDUCTIVE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To minimize the stress to a chip caused by difference of thermal expansion between the chip and a substrate, by applying a conductive silicone pressure sensitive adhesive containing silicone resin, siloxane gum, a conductive particle material and a peroxide catalyst between the flip-chip and the substrate for connection. SOLUTION: A silicone pressure sensitive adhesive contains components A and B. The component A is a soluble organo-siloxane resin made essentially of R3 SiO1/2 siloxane units and SiO4/2 siloxane units. R optimally represents a monovalent group selected from hydrocarbon group and halogenated hydrocarbon group. The component B is polydiorgano-siloxane having a formula. In the formula, R<2> represents a monovalent group selected from hydrocarbon group and halogenated hydrocarbon group. At least 1/2 of all the R<2> groups include methyl, representing a group selected from R<4> , R<2> and OH groups. A catalyst is contained in this component. The adhesive is soft and easily adheres, thus enabling minimization of the stress to a chip caused by difference of thermal expansion between the chip and the substrate.