| 摘要 |
PROBLEM TO BE SOLVED: To obtain a manufacturing method for semiconductor device capable of improving the workability in the formation of solder electrode and stabilizing the amount of solder. SOLUTION: The device comprises only a substrate 4, an IC chip 5, a wire 6, a mold resin 7, and a land 8, and an IC package before forming a solder electrode is prepared on the land 8. Thereafter, a pressure is applied to a solder paste 2a with a squeegee 1, and the solder paste 2a is supplied to the land 8 through a metal mask 3a. By such a screen printing method, the solder printing is performed in several times separately, and solder electrodes are printed on the land 8. Therefore, the solder printing is performed in several times, the amount of the solder paste 2a to be supplied at each time can be less, so that the occurrence of bridges or the like is less and the amount of supply of the solder paste 2a can be stabilized. |
