发明名称 Semiconductor integrated circuit device and package structure for the same
摘要 A semiconductor IC device 100 comprises an active area 102 including a plurality of unit cells 101a and 101b, and a plurality of electrodes 103 disposed in a zigzag fashion along the periphery of the active area 102. Signal I/0 electrodes 103a are disposed on the first row of the zigzag electrode arrangement while the power supply and ground electrodes 103b and 103c are alternately disposed on the second row of the zigzag electrode arrangement. Owing to this constitution, power supply and ground electrode 103b and 103c may exist separately from signal I/0 electrode 103a, so that a sufficient number of power supply and ground electrodes 103b and 103c can be secured even in the case that all of available signal I/0 electrodes 103a are fully used for maximum operation of the circuit portion (active area) 102. <IMAGE>
申请公布号 EP0902471(A3) 申请公布日期 1999.11.03
申请号 EP19980306868 申请日期 1998.08.27
申请人 OKI ELECTRIC INDUSTRY COMPANY, LIMITED 发明人 KOHARA, YOUICHI;OKA, TAKAHIRO
分类号 H01L21/60;H01L21/82;H01L23/485;H01L23/50;H01L23/552 主分类号 H01L21/60
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