ADHESIVE FOR CONNECTING ELECTRODE AND BONDING METHOD USING THE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To obtain an insulating adhesive agent or adhesive film having repairability and conductance reliability and provide a method for connecting the agent, or the like. SOLUTION: The insulating adhesive agent 10 is produced by mixing a low- temperature curing adhesive having radical polymerization thermosetting mechanism with a high-temperature curing adhesive having epoxy-based thermosetting mechanism. The primary bonding (temporary bonding) of an IC chip 30 to a circuit board 20 is carried out at the 80% reaction temperature of the low- temperature curing adhesive using the obtained insulating adhesive agent 10 and the secondary bonding (main bonding) of the IC chip 30 to the circuit board 20 is performed at or above the 80% reaction temperature of the high- temperature curing adhesive.