| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallic substrate having a hard composite element that its aluminum substrate is covered with a high-temperature-resistant insulating layer formed by treating an oxide film. SOLUTION: A prescribed number of chip elements (50) is firmly connected to the substrate (20) and individually connected to their corresponding conductive wires (40). The substrate (20) has a high-temperature resistance characteristic, good heat conductivity, and many depressed sections (21). The insulating layer (30) firmly adheres to the substrate (20) and depressed sections (21). Chip elements respectively arranged on positioning tables (22) are brought into contact with the insulating layer (30). The wires (51) of the chip elements are connected to their corresponding conductive wires (40). In order to improve the product reliability of the substrate (20), the substrate (20) can be dried at a high temperature in a furnace. The substrate (20) and chip elements are assembled in an integral structure. Since the integral structure has a good heat radiating characteristic, the structure can operate at an appropriate temperature and, in addition, can efficiently radiate heat. |
