| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board which can avoid a dimensional change or thermal deterioration of an inner layer plate, can avoid a positional shift between layers, can simplify its process, and can have high accuracy, high density and high reliability. SOLUTION: One or more first stacking units including a single insulating layer of a thermosetting resin sheet containing a reinforcing material and having a wiring layer on its both sides; one or more second stacking units having an insulating layer laminated on one surface of the first unit, having a wiring layer on one major surface and an exposed interlayer connection conductor on the other major surface; and one or more third stacking units having insulating layers laminated on both surfaces of the first unit and having exposed interlayer connection conductors on its two major surfaces; are positioned and laminated so that the interlayer connection conductors and wiring layers are alternately placed in the lamination direction. |
