发明名称 MULTILAYER CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate which uses conductive paste that makes a conductor low in resistance and restrains a structural failure. SOLUTION: The multilayer ceramic substrate is equipped with the laminated ceramic layers, inner conductor films formed on the ceramic layers, and via-hole conductors formed through the prescribed ceramic layers. The conductive paste forming the conductors contains, at least, silver powder and organic vehicles, and the silver powder is composed of, at least, silver powder 10 to 50 nm in diameter and another silver power 55 to 150 nm in diameter. One silver powder and the other silver power different from each other in diameter are mixed together, whereby the sintering of silver advances so as to follow a force generated by the sintering of the ceramic layers. By this setup, a structural failure that may occur between the ceramic layers and the conductors can be restrained from occurring, and also the conductors can be connected together well and made low in resistance because the conductors are formed of only silver powder. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007220856(A) 申请公布日期 2007.08.30
申请号 JP20060039000 申请日期 2006.02.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAMAI HIDEKAZU;KATSUMURA HIDENORI;KAGATA HIROSHI
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址