发明名称 MARINE DEVICE MODULE AND SEALING STRUCTURE OF MARINE DEVICE MODULE
摘要 PROBLEM TO BE SOLVED: To provide a marine device module requiring no welding of the interfacing part between the marine device module and a hull and enabling the securement of waterproofness at the connecting part when the marine device module is mounted on the deck. SOLUTION: This maritime device module comprises a line lead-in hole 9 opened in the bottom surface 23 thereof, a skirt part 22 secured watertight to the bottom surface 23 and surrounding the line lead-in hole 9, and a combing 21 surrounding the line lead-in hole 20 opened in the deck 8. When the maritime device module is mounted on the deck 8 and fixed, the skirt part 22 surrounds the combing 21. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008094360(A) 申请公布日期 2008.04.24
申请号 JP20060282033 申请日期 2006.10.16
申请人 OSHIMA SHIPBUILDING CO LTD 发明人 HORI TATSUAKI;SHIMIZU FUMIO
分类号 B63J99/00 主分类号 B63J99/00
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