发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device for further enhancing processing efficiency.SOLUTION: A laser processing device comprises holding means (6) for holding a workpiece (11), laser irradiation means (30) for irradiating a laser beam (L), processing feed means (8) for relatively moving the holding means and the laser irradiation means in a processing feed direction, indexing feed means (8) for relatively moving the holding means and the laser irradiation means in an indexing feed direction and control means (44) for controlling movements of respective parts, and the control means simultaneously starts a stopping step and an indexing step when being tb>ta, assuming time required for the stopping step of stopping the laser irradiation means to the holding means as ta and time required for the indexing step of adjusting an irradiation position of the laser beam to the next division expected line as tb, and executes a starting step of accelerating the laser irradiation means to the holding means by using a residual time (tb-ta) of the indexing step after finishing the stopping step.SELECTED DRAWING: Figure 1
申请公布号 JP2016132017(A) 申请公布日期 2016.07.25
申请号 JP20150009273 申请日期 2015.01.21
申请人 DISCO ABRASIVE SYST LTD 发明人 SANPEI TAKASHI
分类号 B23K26/00;B23K26/351 主分类号 B23K26/00
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