PRINTED CIRCUIT BOARD AND METHOD MANUFACTURING THE SAME

摘要

A printed circuit board is provided which comprises a core layer of a conductive metal having a thickness between 30 micrometer and 120 micrometer, an upper dielectric layer and a lower dielectric layer sandwiching the core layer; an upper conductive layer arranged above the upper dielectric layer and a lower conductive layer arranged below the lower dielectric layer; at least one via passing from the upper conductive layer to the lower conductive layer and filled at least partially with the dielectric material of the upper and/or lower dielectric layer; and at least one and blind via, connecting the upper conductive layer with the core layer.