| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding structure and a bonding method for surely bonding a gold wire and an aluminum pad. SOLUTION: In the bonding structure of a gold wire 1 and an aluminum pad 2 sealed by a sealant 6 containing bromine, a compound produced between the gold wire 1 and the aluminum pad 2 is set as Au5Al2. In the bonding method of a gold wire and an aluminum pad sealed by a sealant containing bromine, palladium is added to the aluminum pad, so that Au4Al is not created in a compound produced between a gold wire 1a and a aluminum pad 2a. Without palladium being added to the aluminum pad, a palladium film 7 may be deposited on the aluminum pad 2. Furthermore, the aluminum pad 2a may be deposited to surround the aluminum pad 2 or a palladium film 7 which has an opening may be deposited. |
