| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which enables to increase heat radiation in the semiconductor and improve electromagnetic shielding. SOLUTION: It is possible to increase heat radiation by arranging heat radiation members 11 to the vicinities of a semiconductor chip 1 so as to protrude from the surface of the base 2, connecting a metal layer 7 to heat radiation members 11 with heat conductive members 6 and shortening the length of a heat transfer path from the semiconductor chip to the base 2 as much as possible. The heat conductive members 6 themselves can also function as satisfactory electromagnetic shield because the heat conductive members 6 contain metal materials. |
