METHOD FOR BONDING SEMICONDUCTOR CHIP AND STACKING

摘要

A method for adhering and stacking a semiconductor chip on a substrate is provided to prevent deformation and contamination of the semiconductor chip by fixing the semiconductor chip using a protective tape. A protective tape(15) is attached to an upper portion of a semiconductor chip(11) which is separated from a wafer, and then the semiconductor chip is adhered on a substrate(13) by an adhesive(14) which is applied on the substrate or applied on a lower portion of the fixed semiconductor chip. The substrate and the semiconductor chip are heated under a pressure to cure the adhesive. After removing the pressure, the semiconductor chip is adhered on the substrate. Then, the protective tape is removed.