发明名称 EPITAXIAL SILICON WAFER AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To enable to measure LPDs of≤100 nm in a ä110} wafer, thereby preventing deterioration of surface roughness, enabling to determine the surface state and enabling quality evaluation of the wafer. SOLUTION: In an epitaxial silicon wafer, an epitaxial layer is grown on a silicon wafer having a plane inclined from a ä110} plane of a silicon single crystal as a main surface. The silicon wafer for growing the epitaxial layer thereon is configured in such a way that an inclination angle azimuth for inclining the ä110} plane is set in the range of 0-45°as measured from a <100> orientation parallel to the ä110} plane toward a <110> direction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008091891(A) 申请公布日期 2008.04.17
申请号 JP20070228717 申请日期 2007.09.04
申请人 SUMCO CORP 发明人 DOI ATSUYUKI;NAKAHARA SHINJI;SAKURAI MASAYA;SAKAI MASATO
分类号 H01L21/205;C23C16/24;C30B25/20;C30B29/06 主分类号 H01L21/205
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