| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and its manufacturing method having high reliability and such a structure that can reduce the number of processes and required time of the processes largely and can improve the manufacturing yield. SOLUTION: This semiconductor package has the structure wherein a wiring layer 14 is supported by an insulating film 13 in the range corresponding to the chip electrode 12 of the semiconductor chip 11. In its manufacture, the metal connection of the wiring layer 14 with all the bumps 17, and the adhesion of the semiconductor chip 11 with the wiring tape 4 by the bonding agent layer 16, are performed at the same time, by means of inserting the bump 17 into the hole part 16, loading the semiconductor chip on the wiring base material, pressing the wiring tape 4 to almost entire range of the chip electrode forming plane by the heater plate and so forth, and at the same time heating both the bonding agent layer 16 and the inner lead connecting part. |
