发明名称 |
Molded plastic semiconductor package including heat spreader |
摘要 |
There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.
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申请公布号 |
US5608267(A) |
申请公布日期 |
1997.03.04 |
申请号 |
US19940276381 |
申请日期 |
1994.07.18 |
申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK;TYLER, DEREK E.;BRADEN, JEFFREY S.;POPPLEWELL, JAMES M. |
分类号 |
H01L23/28;H01L23/12;H01L23/29;H01L23/31;H01L23/373;H01L23/433;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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