| 摘要 |
PROBLEM TO BE SOLVED: To increase the quantity of solder for improving reliability of soldering by forming larger diameter holes than a through-hole of a conduction part on insulating films on both front and rear faces of the through-hole, and providing lands on both front and rear faces of the conduction. SOLUTION: Diameter holes 1f and 1e with diameters than a through-hole 1d of a conduction 1a are formed on insulating films 1b and 1c respectively, which are on both front and rear faces of the through-hole 1d in a flexible printed wiring board 1, and land portions 1h and 1g are provided on both front and rear faces of the conduction 1a, respectively. After a terminal 2 is inserted into the through-hole 1d of the flexible printed wiring board 1 form the front face side, the terminal 2 is soldered to the land portion 1g from the rear face side by flow-soldering and the like. Thereby, the solder flows into the front face side form the rear face side through the through-hole 1d of the conduction 1a by capillarity, and the land portion 1h of the front face side can be also soldered (a). |
