| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive substrate with high yield capable of preventing the drop in productivity even with a base material with an adhesive of low rigidity, a manufacturing method of a circuit substrate, and a circuit board. SOLUTION: The adhesive substrate 100 includes the base material 101, an adhesive layer 102, and a protective layer 103 which are stacked in this order and is used to be stuck to the circuit substrate 120. The protective layer 103 is positioned with farther extension 105 from a predetermined side of the adhesive substrate 100. The protective layer 103 is equipped with a cut 111 through the layer 103 to surround a positioning hole 106. COPYRIGHT: (C)2007,JPO&INPIT
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