发明名称 PLASMA FILM DEPOSITION APPARATUS, AND PLASMA FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To prevent raw material gas supply at a low flow rate from delaying, to improve production efficiency.SOLUTION: In a plasma film deposition apparatus 100, before pyridine, a raw material gas, is supplied at a low flow rate for nucleus formation to a first film deposition chamber 121 or a second film deposition chamber 122, a gas remaining in a raw material gas supply pipe 113 is evacuated in advance by a vacuum pump 130 via a communication pipe 140. After the remaining gas is evacuated, the raw material gas (pyridine) of which the flow rate is adjusted to be a low flow rate by a flow rate adjusting device 113c is supplied to the first film deposition chamber 121 or the second film deposition chamber 122.SELECTED DRAWING: Figure 1
申请公布号 JP2016108590(A) 申请公布日期 2016.06.20
申请号 JP20140245485 申请日期 2014.12.04
申请人 TOYOTA MOTOR CORP 发明人 KUMAMOTO SHOICHIRO;IKEJIRI TAKASHI;KOIZUMI MASAFUMI
分类号 C23C16/455 主分类号 C23C16/455
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