| 发明名称 | Power module | ||
| 摘要 | A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate. | ||
| 申请公布号 | US9418921(B2) | 申请公布日期 | 2016.08.16 |
| 申请号 | US201514965909 | 申请日期 | 2015.12.11 |
| 申请人 | Industrial Technology Research Institute | 发明人 | Yang Shu-Jung;Chao Yu-Lin;Chien Heng-Chieh;Liu Chun-Kai |
| 分类号 | H01L23/34;H01L23/495;H01L25/18;H01L25/07;H01L23/498 | 主分类号 | H01L23/34 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A power module, comprising: a first substrate, comprising at least one dielectric frame, two first fan-out circuit structure layers, wherein the at least one dielectric frame has two opposite surfaces, the two first fan-out circuit structure layers are respectively disposed on the two surfaces; two dielectric plates, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the at least one opening and the corresponding first fan-out circuit structure layer form at least one concavity; at least two power elements, respectively disposed on the two first fan-out circuit structure layers, wherein the at least two power elements are respectively embedded in each of the at least one concavity of the two dielectric plates; at least one first conductive structure, wherein the at least two power elements are electrically connected to each other through the at least one first conductive structure; and at least one leadframe, disposed at the first substrate and electrically connected to the at least two power elements, and partially extended outside of the first substrate. | ||
| 地址 | Hsinchu TW | ||