发明名称 Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
摘要 According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase inverter situated on a leadframe. The PQFN package further includes drivers situated on the leadframe and configured to drive the multi-phase inverter. The PQFN package also includes bootstrap diodes respectively coupled to the drivers. The bootstrap diodes are in a common integrated circuit (IC) that is situated on the leadframe. The common IC can include the drivers. The drivers can be high side drivers that are coupled to high side power switches of the multi-phase inverter. Also, the bootstrap diodes can be coupled to a supply voltage terminal of the PQFN package. Furthermore, the PQFN package can include wirebonds coupling the common IC to bootstrap supply voltage terminals of the PQFN package.
申请公布号 US9443795(B2) 申请公布日期 2016.09.13
申请号 US201314140285 申请日期 2013.12.24
申请人 Infineon Technologies Americas Corp. 发明人 Fernando Dean;Barbosa Roel;Takahashi Toshio
分类号 H01L23/495;H01L23/31;H01L23/00 主分类号 H01L23/495
代理机构 Shumaker & Sieffert, P.A. 代理人 Shumaker & Sieffert, P.A.
主权项 1. A power quad flat no-lead (PQFN) package comprising: a multi-phase inverter situated on a leadframe; drivers situated on said leadframe and configured to drive said multi-phase inverter; bootstrap diodes respectively coupled to said drivers, said bootstrap diodes being in a common integrated circuit (IC) that is situated on said leadframe; wherein at least one of said drivers is coupled to a first leadframe strip, said first leadframe strip extending from a first die pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.
地址 El Segundo CA US